For more details on the courses, please refer to the Course Catalog
| Code | Course Title | Credit | Learning Time | Division | Degree | Grade | Note | Language | Availability |
|---|---|---|---|---|---|---|---|---|---|
| CES2003 | Semiconductor Basic Chemistry | 3 | 6 | Major | Bachelor | 1-2 | Advanced Semiconductor Convergence Track | - | No |
| This lecture is set up to introduce the students to modern chemistry. The lecture can be classified into two categories. The first part introduces basic concepts that provide the necessary background for many of the laboratory experiments usually performed in general chemistry. The second part deals with electronic structure and bonding of atoms and molecules. The focus then changes to the organization of matter, states and matter(phase changes), and solutions. | |||||||||
| CES2004 | Semiconductor manufacturing process and materials | 3 | 6 | Major | Bachelor | 2-3 | Advanced Semiconductor Convergence Track | - | No |
| This course covers the principles and applications of various unit processes used for the fabrication of semiconductor devices: materials, lithography & etching, oxidation, diffusion, ion implantation, and thin film deposition. Lastly, based on the in-depth understanding of unit processes, integration processes such as metallization will also be studied. Through this, students will learn in detail about the eight major processes and materials related to semiconductor manufacturing, allowing students to quickly acquire basic knowledge related to semiconductor manufacturing. | |||||||||
| CES2007 | Basics of semiconductor materials analysis | 3 | 6 | Major | Bachelor | 2-3 | Advanced Semiconductor Convergence Track | - | No |
| This course is designed to help undergraduate students understand and follow various experimental techniques that are useful in the field of basic semiconductor materials analysis. Therefore, this course consists of an introduction to the operating principles and practical characteristics of microscopy and spectroscopy techniques that are widely used in research and industrial fields. This course will be operated in a kind of semi-flipped learning manner, where pre-recorded lecture videos will be provided and real-time lectures will be conducted with reviews, questions and answers, and discussion classes. | |||||||||
| CES3001 | Semiconductor process material properties | 3 | 6 | Major | Bachelor | 2-3 | Advanced Semiconductor Convergence Track | - | No |
| In this lecture, we learn about electronic materials and their bonding, which are the basis for understanding and application of electronic device driving principles, and study the synthesis, characteristics, and application cases of various nanoelectronic materials. In the first half of the lecture, we study electronic materials and bonding theory based on quantum mechanics and solid-state chemistry, and in the second half of the lecture, we introduce the synthesis and application of various nanoelectronic materials such as organic, inorganic, and organic-inorganic composite materials. In particular, we study examples of electronic materials that have recently been attracting attention in the industrial world and how what we studied theoretically can be applied to the actual implementation of electronic devices. | |||||||||
| CES3005 | Semiconductor packaging | 3 | 6 | Major | Bachelor | 3-4 | Advanced Semiconductor Convergence Track | - | No |
| In this course, students will learn about semiconductor packaging technology, which is a post-process of semiconductor Fab. Tech. Semiconductor packaging technology includes multiple processes such as material bonding, interconnection, wiring, encapsulation, and reliability evaluation, and interdisciplinary convergence research is essential as technologies from various fields should be employed. In this lecture, semiconductor packaging technology is dealt with in depth by individual process, and the impact of AI and IoT technologies on packaging technology will be discussed. Through this, students will build theoretical and practical knowledge on next-generation smart semiconductor packaging technology. | |||||||||
| CES3006 | System and memory semiconductor design | 3 | 6 | Major | Bachelor | 3-4 | Advanced Semiconductor Convergence Track | - | No |
| First ever lecture on each covering introduction of memory systems that is the first part of the computer architecture and all kinds of semiconductor memory products. I am going to give you a strong base to work as a semiconductor memory developer as well as computer architect or memory architect. Through this course, you will learn in detail about system and memory design to acquire professional knowledge in the field of semiconductor memory and system-related design. | |||||||||
| CES3007 | Introduction to Artificial Intelligence Machine Learning | 3 | 6 | Major | Bachelor | 3-4 | Advanced Semiconductor Convergence Track | - | No |
| Machine learning studies how to make computers learn from data or experience. It has become a key component of modern Artificial Intelligence (AI) systems and has been successfully used in many industrial applications, such as self-driving cars, assistive robots, chatbots, advanced searching, advertising, and so on. This course introduces key concepts and foundations of ma-chine learning and various popular algorithms being used in real-world problems. Through this course, you will learn the basic knowledge related to artificial intelligence machine learning necessary for the semiconductor field and develop the ability to apply it to the semiconductor field. | |||||||||
| ECE4278 | SOC Design and Practice | 3 | 6 | Major | Bachelor/Master | 1-4 | Electrical and Computer Engineering | - | No |
| This course delivers fundamentals of SoC design, including basic concepts, components, and design flows. It provides an introduction to SoC and its components. It also teaches design flows of SoC, including Register-Transfer-Level (RTL) design, verification, logic synthesis, formal verification, clocking, synchronous/asynchrouns signal interface. | |||||||||
| ECE4281 | Flexible Electronic Materials | 3 | 6 | Major | Bachelor/Master | 1-4 | Electrical and Computer Engineering | Korean | Yes |
| The course covers the basic concepts for understanding the electrical and mechanical characteristics of flexible functional electronic materials. Based the basic knowledge, we will learn fundamental technologies such as transfer-printing and printing processes for fabricating the flexible electronic devices. Based on the basic knowledge originating from Electric Circuits, Logic Circuits, and Solid State Electronic Devices, we will understand how RLC filters/amplifiers, transistors, logic gates, resistive random access memory devices stably operate under tensile/compressive strains. The aim of this class is to provide opportunities for learning the application to flexible display modules, sensors, and wireless integrated circuits. | |||||||||
| ECE4283 | Intelligent System Integrated Circuit Design | 3 | 6 | Major | Bachelor/Master | 1-4 | Electrical and Computer Engineering | - | No |
| In this course, intelligent system integrated circuits are covered. Especially, recent research trends of the intelligent power management circuit, AI based sensor signal processing circuits will be dealt and design practice using the EDA tools will be done. | |||||||||
| EEE2007 | Semiconductor Electronics | 3 | 3 | Major | Bachelor | 2-3 | Electronic and Electrical Engineering | Korean | Yes |
| A background information of Physics in Electronics will give plenty of benefits to the student taking this course. Junction analysis is expanded from homojunc-tion to heterojunction. Semiconductor growth technology, diffusion mechanism, donor and acceptor materials, metalization method and surface state effect of semiconductor are described mainly featuring silicon and compound semiconductorsThe main stream line of the lecture will be the different semiconductor device applications such as bipolar transistors, field effect transistors, integrated circuits and optoelectronic devices like light emitting diode, photovoltaic devices, laser, detectors. device application includes device fabrication, analysis, design and characterization of the different semiconductor devices. | |||||||||
| EEE2008 | Signals and Systems | 3 | 3 | Major | Bachelor | 2-3 | Electronic and Electrical Engineering | English | Yes |
| Fundamentals of the analysis and processing of continuous and discrete signals in both time and frequency domains. Linear Time Invariant (LTI) systems and filtering. convolution, Fourier Series(FS), Fourier Transform(FT), Transform(DFT), Introduction to analog and digital communications and the Sampling Theorem Computer based simulation and data processing are used to demonstraste the above concepts in a laboratory settings. | |||||||||
| EEE2011 | Circuit Theory I | 3 | 3 | Major | Bachelor | 2-3 | Electronic and Electrical Engineering | English | Yes |
| Circuit element, Kirchhoff's law, Ohm's laws. Sine wave altenating current, Instantaneous value, average value, effective value. R-L-C series circuit and parallel circuit. Phasor representation of sine wave AC, impedance and admittance circuit. Two port network, bridge circuit, coupled circuit. Active power, complex power. Constant voltage and current source. Thevenin's and norton's theorem. Polyphase AC curcuit, balanced and unbalanced 3-phase curcuit, method of symmetrical coordinates. | |||||||||
| EEE3006 | Modern Optics | 3 | 3 | Major | Bachelor | 3-4 | Electronic and Electrical Engineering | Korean | Yes |
| The goal of this class is to understand the propagation of light in free space and in materials. The light propagation is first explained by the wave theory or Huygens's principle. Then the principles of reflection and refraction are explained. Next the light propagation is explained by the oscillating dipoles of atoms. Based on this theory the light scattering is explained. Next the operation of simple optical systems such as simple lens system, compound lens system, camera and human eyes is explained. | |||||||||
| EEE3011 | Digital Signal Processing | 3 | 3 | Major | Bachelor | 3-4 | Electronic and Electrical Engineering | Korean | Yes |
| The topics to be covered are : Analysis and process techniques used in computer processing of signals. Analog to digital conversion. Recursive digital filters, and matched filters. Time series analysis of waveforms, z-transforms, and Fast Fourier transforms (FFT) for digital signal analysis, complex demodulaion and data compression. Cepstrum tecnique and spectral estimation. | |||||||||