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  • Advanced Semiconductor Engineering(Interdisciplinary)
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Advanced Semiconductor Engineering(Interdisciplinary)

For more details on the courses, please refer to the Course Catalog

교육과정
Code Course Title Credit Learning Time Division Degree Grade Note Language Availability
ASE3001 Advanced Digital System Design 3 6 Major Bachelor 3-4 Korean Yes
This course is a front-end design course for digital system semiconductor chip. This course provides an understanding and utilization of synthesis coding techniques and synthesis tools that are most important for System On Chip (SoC) design. * Verilog Coding Style for RTL Synthesis - Overview of RTL(Register Transfer Level) synthesis - Verilog => Combinational Circuits - Verilog => Sequential Circuits - Resource Blocks and Resource Sharing - Collection of Unsupported Coding Styles and Their Resolution - Simulation <=> Synthesis Mismatches - Efficient Synthesis Coding Style - Migration of Digital Design Experiences - Coding Styles for Design Reuse - Non-Trivial Verilog Analyze Errors * Overview of Synthesis and Synthesize a block-level RTL design - Design and Technology Data - Design and Library Objects - Timing Constraints - Environmental Attributes - Synthesis Optimization Techniques - Timing Analysis - Additional Constraint Options - Multiple Clocks and Exceptions - Congestion Analysis and Optimization - Post-Synthesis Output Data
ASE3002 Introduction to Semiconductor Products 3 6 Major Bachelor 3-4 Korean Yes
In this course, the goal is to gain a comprehensive understanding of semiconductor memory technology through an introduction to the basic structure, operating principles, reliability characteristics, key issues in development, and future technologies of various semiconductor memory products.. - Introduction to the semiconductor memory technology development environment and key issues. - DRAM product technology. - Flash product technology. - New Memory (MRAM, PRAM, RRAM) technology
ASE3003 Vacuum and Plasma Technology 3 6 Major Bachelor 3-4 Korean Yes
This lecture includes topics of vacuum and plasma technology for semiconductor device manufacturing. - Fundamentals of vacuum - Vacuum pumps - Vacuum gauges - Vacuum system - Plasma fundamentals - Physical properties of plasma and plasma sources - Plasma physical processes: PVD, ion implantation, others - Plasma chemistry - Plasma chemical processes: PECVD, PEALD, Etching, Cleaning - Plasma diagnostics and monitoring technology - Plasma systems
ASE3004 Next Generation Semiconductor Integrated Design 3 6 Major Bachelor 3-4 Korean,Korean Yes
- This lecture aims to provide undergraduate students with experience in problem-solving methods required by industry through understanding the technologies needed in the industrial field, identifying problems in implementation, and exploring solutions. - By participating in projects jointly carried out with industry and experiencing necessary facilities and equipment, students can acquire practical experience needed by industry. - Students can also expect advancement of convergent expertise by sharing the progress of other projects in addition to participating projects.
EAM2057 Introduction to Advanced Materials Engineering 1 3 6 Major Bachelor 2 Advanced Materials Science and Engineering English,Korean Yes
This course provides fundamental approach for understanding all the types of materials. Specifically, atomic structure and bonding, structures of metals and ceramics, and polymer, imperfections in solids and diffusion will be introduced. In addition, mechanical properties, phasse diagrams and phase transformations will be studied.
EAM2058 Introduction to Advanced Materials Engineering 2 3 6 Major Bachelor 2 Advanced Materials Science and Engineering English,Korean Yes
The class aims to introduce the basic properties of materials. Specifically, electrical properties such as electrical conductivity, semiconductor, and dielectric properties will be studied. In addition, types and applications of materials, corrosion and degradation of materials, and thernal, magnetic, and optical properties of materials will be introduced.
EAM3003 Phase Transformation 3 6 Major Bachelor 3-4 Advanced Materials Science and Engineering English Yes
Thermodynamics and kinetics of phase transformations, phase transformation mechanisms, phase change in metals and alloys, massive and order-disorder transformations, martensitic transformation, and precipitation hardening.
EAM3038 Thin Film Processing 3 6 Major Bachelor 3-4 Advanced Materials Science and Engineering English Yes
This class will teach thin film fabrication methods such as physical vapor deposition and chemical vapor deposition methods which are used to fabricate thin films within the range of a few microns. After the fabrication methodology,effects of process conditions on electrical, physical, chemical, and mechanical properties will be discussed in details. Along with these properties, surface and thin film characterization tools, such as Auger, XPS, SIMS, RBS, and TEM will be discussed for their applicability to various thin films. Basic theorieson vacuum techniques, vacuum pumps and vacuum measuring equipments also will be discussed in the class.
EAM3088 Understanding of Advanced Materials Characterization 3 6 Major Bachelor 3-4 Advanced Materials Science and Engineering English,Korean Yes
With the suggestion of various advanced devices, the understanding of the methods to utilize advanced materials characterization tools is also essential in the field of materials science and engineering. This class is to study the fundamental knowledge on analysis instruments with various materials, to distinguish pros and cons of individual tools, and finally perform the characterizatio of the real examples. This study is available to apply in the field study of research and industry.
ECE4278 SOC Design and Practice 3 6 Major Bachelor/Master 1-4 Electrical and Computer Engineering Korean Yes
This course delivers fundamentals of SoC design, including basic concepts, components, and design flows. It provides an introduction to SoC and its components. It also teaches design flows of SoC, including Register-Transfer-Level (RTL) design, verification, logic synthesis, formal verification, clocking, synchronous/asynchrouns signal interface.
ECE4279 Memory Semiconductor Design 3 6 Major Bachelor/Master 1-4 Electrical and Computer Engineering English Yes
CMOS memory devices are known as traditional digital devices. In order to suffice tough requirements for advanced IC’s and artificial intelligence applications, new memory devices beyond conventional DRAM/SRAM/flash are suggested. This course starts from brief review of memory system, and expands to operating principles of memory devices, design practice, and performance metrics. New memories such as emerging non-volatile memories, content addressable memory, and process-in-memory are covered at the end of course. Practice on memory circuit design and evaluation is included as a part of homework assignment.
ECE4282 AI Integrated Circuits Design 3 6 Major Bachelor/Master 1-4 Electrical and Computer Engineering Korean Yes
In this course, AI Integrated Circuits are covered. Especially, recent research trends of the Processor In Memory (PIM) with the good energy efficiency will be dealt and design practice using the EDA tools will be done.
ECE4283 Intelligent System Integrated Circuit Design 3 6 Major Bachelor/Master 1-4 Electrical and Computer Engineering Korean Yes
In this course, intelligent system integrated circuits are covered. Especially, recent research trends of the intelligent power management circuit, AI based sensor signal processing circuits will be dealt and design practice using the EDA tools will be done.
ECE4284 Automotive Embedded Software 3 6 Major Bachelor/Master Electrical and Computer Engineering English Yes
This course describes automotive embedded software and automotive software standard architecture, AUTOSAR Classic. The aim is to understand the main characteristics of automotive embedded software and to get hands-on experience developing software based on AUTOSAR Classic.
ECE4286 Artificial intelligence semiconductor memory device 3 6 Major Bachelor/Master Electrical and Computer Engineering - No
Artificial intelligence algorithms based on deep neural networks (DNN: Deep Neural Networks) are demonstrating performance that is similar to or exceeds that of humans in many complex cognitive tasks. However, the energy efficiency of current Neumann computing systems implementing deep neural network algorithms is very low compared to the human brain. To solve this problem, neuromorphic hardware, which consists of densely connected parallel neurons and synapses that mimics the brain neural network structure, was proposed. The objective of this lecture is to deliver a driving principles of neuromorphic hardware and memristor memories, which expresses the weight of synapses in neuromorphic hardware. It will be introduced the operating principles of various memristors, including floating gate memory type, resistive memory type, phase change memory type, magnetic random access memory type, and ferroelectric memory type.