For more details on the courses, please refer to the Course Catalog
| Code | Course Title | Credit | Learning Time | Division | Degree | Grade | Note | Language | Availability |
|---|---|---|---|---|---|---|---|---|---|
| SDE5040 | SSIT seminar2 | 1 | 2 | Major | Master/Doctor | Korean | Yes | ||
| Through introductory seminars on semiconductor technology and other fields, it aims to increase convergence thinking ability and to improve belonging and bond among SSIT employees. | |||||||||
| SDE5041 | Advanced Semiconductor Technology | 3 | 6 | Major | Master/Doctor | - | No | ||
| The purpose of this course is to enhance theoretical understanding and cultivate practical ability of the latest semiconductor technology. This lecture covers semiconductor design, process and S/W by inviting executives and engineers from Samsung electronics DS, a global integrated device manufacturer. | |||||||||
| SDE5042 | Semiconductor Devices Characterization | 3 | 6 | Major | Master/Doctor | Korean | Yes | ||
| The purpose of Semiconductor Device Characterization is to understand how to measure and analysis electrical properties (resistivity, contact resistance, defect, mobility, etc.) with various examples to practical help in semiconductor-related graduate student and development status. Through this curriculum, we would like to learn ad understand the various device characterization included with physical analysis method (SIMS, XPS, TEM, etc.). | |||||||||
| SDE5043 | Special Topics in Semiconductor Computing Systems | 3 | 6 | Major | Master/Doctor | Korean | Yes | ||
| Recently, application systems using modern semiconductor products have been drastically evolved together with the explosive growth of the cloud and datacenter computing. Furthermore, we are also facing another innovative era changing due to new application arrivals such as AI and Metaverse as well as AR and XR. In this period of change, we first learns in this course the principles of basic computing systems for major applications and how each hardware/software component operates systematically. In addition, in this course, based on these theories, we learn the latest system architectural changing trends for each application and various cutting-edge technologies applied to improve its system performance. The final goal of this course is to gain technical insights on the future direction of semiconductor development by examining the current application system designs, system requirements, and technical challenges that exist and various technical approaches to solve and improve them. | |||||||||
| SDE5044 | 3D Semiconductor Product: Advanced Topic | 3 | 6 | Major | Master/Doctor | Korean | Yes | ||
| Flash memory opened the era of 3D semiconductors. It is anticipated that 3D technology will enable various semiconductor devices and products to achieve increased capacity, enhanced performance, lower power consumption, and smaller form factors in the future. This advancement in 3D semiconductors is particularly crucial for applications like artificial intelligence, autonomous driving, and robotics, which are often referred to as the second Internet revolution. By utilizing 3D semiconductors, technological advancements will be made that surpass the limitations of traditional 2D technology. This lecture introduces 3D semiconductor product technology emerging in flash memory, next-generation memory, and chiplet technology, and takes time to understand and anticipate the direction and reality of technological innovation that may appear in various semiconductor fields in the future through in-depth understanding. | |||||||||
| SDE5045 | Plasma Application Engineering | 3 | 6 | Major | Master/Doctor | Korean | Yes | ||
| Mathematical modeling of plasma used in semiconductor process, distribution of electron and ion energy, equipment structure such as CCP ICP ECR, impedance matching technology, plasma diagnosis method using probe, and plasma simulation practice using software. Principles of dry etching and plasma enhanced CVD using AC plasma and physical vapor deposition using DC plasma and the latest trends in each process. Theoretical implications of micro-patterning techniques based on chemical reactions on the surface of each process, selectivity mechanisms, physical and electrical properties of thin films, and equipment methodologies emerging to meet future challenges. | |||||||||
| SDE5046 | Advanced thin films engineering | 3 | 6 | Major | Master/Doctor | Korean | Yes | ||
| This lecture introduces various physical and chemical methods for the generation and measurement of vacuum, the operation of vacuum systems, and the growth of thin films, and describes the atomic and kinetic mechanisms involved. It also explains the atomic and kinetic mechanisms involved. This lecture Introduce advanced physical vapor deposition, chemical vapor deposition, and atomic layer deposition as thin film growth processes, as well as various plasma applications and monitoring techniques. Methods for analyzing the electrical, optical, chemical, and structural properties of thin films and their surfaces are also introduced. Thin film engineering lectures cover vacuum technology, plasma properties and generation, thin film growth, process monitoring and related atomic mechanisms, physical properties of thin films, thin film properties, and device applications of thin films. | |||||||||
| SEE4001 | Special topics in semiconductor devices and processing | 3 | 6 | Major | Bachelor/Master | 1-4 | Semiconductor Convergence Engineering | Korean | Yes |
| On-site processing required for semiconductor device manufacturing experts give lectures directly so that students acquire the knowledge they need in the field. Additionally, through this lecture, students understand the physical operating principles and structure of manufacturing equipment. As semiconductor devices become highly integrated, we look at recent process and equipment development trends and problems with current processes that have become issues. | |||||||||
| SEE4003 | AI Semiconductor Device Simulation | 3 | 6 | Major | Bachelor/Master | 1-4 | Semiconductor Convergence Engineering | Korean | Yes |
| We introduce the latest semiconductor technologies such as ultra-low power logic operation and multi-function memory operation, which are the characteristics required for semiconductors to run artificial intelligence algorithms, and optimize semiconductor technology through actual simulation based on our understanding of these. The electrical characteristics of 3D semiconductor devices due to semiconductor device scaling, ultra-low power semiconductor devices due to new charge transport mechanisms, and memory devices based on various new devices are confirmed through actual simulation exercises and optimized and adjusted by adjusting device design parameters. Check the impact on the operation of the artificial intelligence algorithm. Through this course, you can develop an understanding of the latest semiconductor device theory, especially artificial intelligence semiconductor device theory, and develop not only theory but also basic practical skills by selecting practical topics that can be frequently experienced in the actual industry and carrying out projects. There is a purpose. Prerequisite courses include physical electronics, semiconductor engineering, semiconductor device design, and electronic circuits. | |||||||||
| SUP5002 | Computer Architecture and Its Applications to Artificial Intelligence | 3 | 6 | Major | Master/Doctor | 1-4 | Superintelligence Engineering | - | No |
| This course focuses on principles and mechanisms related to the modern computer architecture including numerical representation, arithmetic operations, datapath and pipelining, cache hierarchies, memory systems, storage and I/O systems. As an application of computer architecture, this course also covers recent HW architectures and techniques for efficient training and inference of AI (especially deep learning) models. | |||||||||
| SUP5009 | Bioelectronic Devices and Intelligent Information Processing | 3 | 6 | Major | Master/Doctor | 1-2 | Superintelligence Engineering | Korean | Yes |
| The course covers the flexible electronic/bioelectronic materials and functional devices. Furthermore, various fabrication methods and characteristic analyses regarding soft electrodes, sensors, and non-volatile memories will be addressed. In addition, this course covers diverse artificial intelligence applications for effectively achieving high-fidelity physiological signals and biomedical images. For example, one topic is to discuss recent progress and limitation of sensors, memory devices, and artificial intelligence and predict their future prospects. The one goal of the course is to develop the ability of solving issues via various engineering aspects. | |||||||||
| WIS5059 | Wired-and-Wireless Communications and Computer | 3 | 6 | Major | Master/Doctor | 1-4 | Interaction Science | - | No |
| The goal of this course is to provide IS(Interaction Science) graduate students with the knowledge about wired-and-wireless communications that are used by computers and mobile computing devices (e.g., Smartphones, Tablets, and Laptops) for various services through cloud. This course decomposes the Internet technology (as the core of computer networks) into multiple layers and explains protocols required for those layers. That is, based on the OSI (Open Systems Interconnection) model, this course divides the Internet architecture into Physical layer, Data link layer, Network layer, Transport layer, and Application layer and then articulates the protocols necessary for running services in each layer. This course is designed to deliver lectures with 9 topics as follows. 1. Computer Networks and the Internet 2. Application Layer 3. Transport Layer 4. The Network Layer 5. The Link Layer and Local Area Networks 6. Wireless and Mobile Networks 7. Multimedia Networking 8. Security in Computer Networks 9. Network Management | |||||||||